Uncooled infrared sensor markets have grown dramatically over the past decade in various fields, including military and commercial applications. The industry has been driven by the need for high resolution in military settings and low cost in commercial markets. This paper presents a brief overview of the status of TiOx-based SXGA(1280x1024) 8μm pitch uncooled infrared sensor status with 0.18μm 3D MEMS technology and 4 channel simultaneous integration circuit to improve performance.

 

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